Osaka Titanium Technologies Builds New Polycrystalline Silicon Plant

Osaka Titanium Technologies announced on Wednesday the firm constructs a new factory of polycrystalline silicon for semiconductors inside Kishiwada plant, Osaka, Japan. Kishiwada plant is now under construction to start titanium ingot shipment in October 2009. A polycrystalline silicon factory will be established on the same site with capacity at 2,200 tonnes a year to start shipment in April 2011. Capital expenditure is 45 billion yen. The firm’s output capacity of polycrystalline silicon will expand by 2.5 times to 3,600 tonnes per annum.A titanium melting factory is now under construction on Kishiwada plant’s 69,000-square-meter site. Construction of a polycrystalline silicon factory will start within 2009 on about 30,000-square-meter land. Osaka Titanium Technologies concluded a 7-year supply contract of polycrystalline silicon with SUMCO, a world largest supplier of monocrystalline silicon wafers for semiconductors, and the contracted supply will start in April 2011.Osaka Titanium Technologies has produced polycrystalline silicon in Amagasaki plant, Hyogo, Japan and has expanded the capacity. The firm plans to expand Amagasaki’s capacity to 1,400 tonnes a year from current 900 tonnes with 66 billion yen capex. The first stage completed in May 2007 and the capacity reached 1,300 tonnes a year. The second stage is scheduled to complete in October 2008. The firm has planned to raise the capacity to 1,450 tonnes a year in 2009 by productivity improvement.