Japanese Appliance Makers Inactive to Adopt Low Silver Solder

Japanese electric appliance makers are now inactive to adopt low silver content soldering products. Major appliance makers were temporarily positive to adopt new lead-free solder containing silver at 0.3% but they currently specify Sn/Ag3.0/Cu0.5 alloy as standard lead-free solder. Low silver content solder is unlikely to penetrate in Japanese market.

In Japan, Sn/Ag3.0/Cu0.5 alloy became de facto standard of lead-free solder after RoHS (Restriction of Hazardous Substances) came into effect in July 2006 and JEITA (Japan Electronics and Information Technology Industries Association) recommended the use of Sn/Ag3.0/Cu0.5 alloy for lead-free appliances.

During 2005-2007, tin market price tripled and silver market price doubled. Japanese major appliance makers and solder makers developed low silver content alloy with 0.3% silver and gained JEITA’s recommendation to cover the material cost up.

However, the adoption trend totally calmed down because nonferrous metal market prices dropped after Lehman Shock in autumn 2008. Japanese appliance makers turned inactive to adopt the new solder alloy though nonferrous metal prices recovered in 2009. Low silver content solder shows different mechanical properties and high melting point compared with Sn/Ag3.0/Cu0.5 alloy. Appliance makers need to adopt high-heat-resistant designs for printing circuit boards and mounting components.

Meanwhile, offshore users are interested in cheaper soldering products, including low silver content solder. Osaka headed solder maker, Nihon Superior is increasing the sales of its original solder alloy Sn/Cu/Ni in Asia, Europe and USA. The alloy contains copper at 0.7% with a slight volume of nickel.