Osaka based Tatsuta Electric Wire & Cable announced on Wednesday the firm starts second-phase capacity expansion for EMI (electro magnetic interference) shielding film at Kyoto plant, Japan one year earlier than previously planned. The firm accelerates the capacity expansion to meet strong demand from smartphone related applications or small-lot deliveries. Kyoto plant’s capacity will double to 400,000 square meters per month.
Tatsuta plans to increase production of EMI shielding film stuck on general flexible printed circuit board (FPC) at Kyoto plant. Tatsuta’s total output capacity including Kyoto plant and Osaka plant will reach 600,000 square meters per month after Kyoto’s expansion. The firm invests approximately 500 million yen for the capacity up. The space is already prepared. Construction of new facilities will complete in April 2011. Tatsuta started commercial sales of EMI shielding film in 2000. The demand has increased from cellular phone related applications. Recently the demand is also growing to adopt into smartphones. The orders are increasing from South Korean users.Japan Steel Scrap Composite Prices (Sangyo Press)
- Agenda for Change Agreement
- Retention Bonus Agreement Pdf
- Car Rental Agreement Sample Free Uk
- Company Sale and Purchase Agreement Template
- Party Wall Agreement Cost London
- Wto Sps Agreement Ppt
- Athlete Representation Agreement
- Property Management Agreement Example
- China-Europe Comprehensive Investment Agreement
- Agreement on Subsidies and Countervailing Measures
- Agreement for the Provision of Marketing Services
- Prenuptial Agreement Form Nys
- Home for Sale by Owner Contract Form
- Business Combination Agreement Lilium
- Uk Dutch Double Taxation Agreement
- Quickbooks Online Service Agreement
- Simple Loan Agreement with Balloon Payment
- Agreements Form
- Liquidated Damages for Breach of Confidentiality Agreement
- An Agreement Synonyms