Tanaka Holdings announced on Thursday the bonding wire making unit, Tanaka Denshi Kogyo launches copper bonding wire at plant in Hangzhou, China for 1 billion yen and triples production capacity of Singapore plant. Wire capacity of the firm’s 3 plants including Japanese Saga plant doubles to 200 million meters per month through March 2012.
Tanaka Denshi Kogyo also announced on Thursday the firm launched palladium coated copper bonding wire production. Raw material of bonding wire is shifting from gold to low-priced copper. The firm launched the new copper wire production to meet trend to improve corrosion resistance of the copper wire by coating technology. World bonding wire production is 1-1.2 billion meters per month, of which copper wire represents 15%. The firm expects the copper wire rate would increase to around 40% in 2013.Japan Steel Scrap Composite Prices (Sangyo Press)
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