Tanaka Holdings announced on Thursday the group company, Tanaka Denshi Kogyo starts commercial sales of three new type bonding wires on January 13. A gold bonding wire with extremely high connective reliability named GPH, a copper bonding wire with stable bonding performance named CFB-1, and the other copper bonding wire for next-generation power devices named CHA. Tanaka Denshi Kogyo is the world top supplier of bonding wires, which has 40% market shares.
GPH can maintain its connective reliability for 4,000 hours even under high temperature at 175 degrees, almost double of the conventional bonding wires adopted to halogen free resins. GPH is applicable for automotive electronic devices. CFB-1 represents more stable bonding performance than conventional copper bonding wires. CHA can be used as an alternate for aluminium bonding wire connected to next generation power devices. Tanaka Denshi Kogyo targets monthly sales of 400 million yen for these new three type bonding wires and plans to raise its global market share to 50% from present 40%.Japan Steel Scrap Composite Prices (Sangyo Press)
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