Shin-Etsu Chemical to Expand 300mm Wafer Output to 1 million units

Shin-Etsu Chemical announced on Wednesday the firm decided to expand the output capacity of silicon wafer with 300 millimeters of diameter by 40% from current 700,000 units per month to 1 million units. The firm expands the Single crystal ingot output capacity while the firm expands the output sites including new operation. The firm tries to meet higher demand. The firm operates wafer business at the main plant of Shin-Etsu Handotai’s Shirakawa Plant in Fukushima, the US subsidiary, Shin-Etsu Handotai America in Washington state and Mimasu Semiconductor Industry in Gunma, which became Shin-Etsu Group firm this year. The firm expands output capacity of the 3 sites while the firm introduces new production facility at Nagano Electronics Industrial in Nagano expanding the base to 4 sites. The firm also introduces new production line for single crystal ingot, which is material for silicon wafer, at Shin-Etsu Hondotai’s Takefu Plant in Fukui along with expansion at traditional production bases in Shin-Etsu Handotai’s Shirakawa Plant and Shin-Etsu Hnadotai America to expand the output. The firm tries to expand the output just after the firm expanded the output capacity of 300 mm wafer to 700,000 units per month in the summer ahead of original schedule. The firm invests cumulative 400 billion yen for 300 mm wafer.