Osaka based solder maker, Nihon Superior announced on Tuesday the firm developed new rosin-cored lead free solder “SN100C (030)” with higher melting rate. The firm will start sample shipment next month.SN100C (030) is free from burning and flux scattering thanks to its higher melting rate than existent resin-cored lead free solder. New solder is expected to improve manufacturing efficiency, productivity and costs. Nihon Superior confirmed less burning, less flux scattering, less flux residue cracks, better continuous soldering, higher melting rate and finer wettability of SN100C (030) in evaluating tests. Especially the new solder showed twice or three times better functions to prevent flux scattering and flux residue cracks.
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