Japan Nonferrous Firms Expand Semiconductor Bonding Materials

Japanese nonferrous metal makers expand the output capacity of bonding tape materials for semiconductor. Mitsui Mining & Smelting started no.3 plant with monthly 20 million units of output capacity in Omuta, Fukuoka. The firm expands the capacity gradually depending on the market and eyes 120 million units at the no.3 plant in 4 years, which represents 60% expansion from now. Hitachi Cable also increased the capacity by 30% in the year. They try to meet growing demand for digital equipment through the aggressive expansion. Mitsui Mining & Metals, which is the world largest supplier of semiconductor bonding materials including chip on film and has 50% share in the world, produces monthly 200 million units of the materials at the no.1 and no.2 plants of the subsidiary, MSC in Yamaguchi. Hitachi Cable started the 30% expansion capacity for chip on film at Kofu plant, Yamanashi in April. The firm now has monthly 75 million units of output capacity in chip on film or 150 million units in chip scale package. The firm pumps up the operation toward the end of the year. Sumitomo Metal Mining produces double layered copper clad substrate for chip on film at Isoura plant, Ehime. The firm has world 85-90% share in double layered substrate for large liquid crystal panel with more than 10 inches. The firm has annual 6.5 million square meters of output capacity after expansion from the start of 600,000 square meters capacity in 2001. The firm eyes 8 million square meters of capacity to meet the growing demand.