Osaka based solder maker, Nihon Superior developed new solder product series based on its lead free solder “SN100C.” The firm will commercialize the new products in 2008. SN100C is tin-copper-nickel alloy with slight volume of germanium with less shrinkage cavity, less corrosion of solder bathes and less growth of alloy layers.The new products are lead free solder paste, ball, wire with resin core and post flux. New solder paste, “ePaste” was developed to reduce void generation for power semiconductors. New solder ball, “eBall” has higher impact resistance. New solder wire with resin core, “eCore” prevents self burning under high temperature. New post flux, “eFlux” has better wettability.
Japan Steel Scrap Composite Prices (Sangyo Press)
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