Mitsui Mining & Smelting Develops New Embedded Capacitor Material

Mitsui Mining & Smelting announced on Wednesday the firm developed a new embedded capacitor material, “AEC-1.” The material is composed of a ceramic dielectric layer sandwiched with an upper electrode of copper and a bottom electrode of nickel. The new material is thinner by about 20% and the capacitance density per square centimeter is more than 500 times compared with the firm’s existent material with a resin dielectric layer. The material will contribute to downsizing and sophisticating of mobile machines. Mitsui Mining & Smelting aims to commercialize the material in next 5 years. AEC-1 is a newly developed capacitor to be embedded in a printed circuit board. AEC-1 realized capacitance density at more than 1 microfarad per square centimeter, 500 times as high as Mitsui Mining & Smelting’s existent embedded capacitor material, “FaradFlex.”FaradFlex is composed of a dielectric layer of 10-20 micrometer thick resin sandwiched with upper and bottom electrodes of 35 micrometer thick copper foils. AEC-1 uses barium titanate based ceramic for a dielectric layer whose thickness is about 0.6 micrometers. The bottom electrode is 50 micrometer thick nickel and the upper electrode is 20 micrometer thick copper. The total thickness of ACE-1 is 70 micrometers, thinner than 80-90 micrometers of FaradFlex.