Tanaka Denshi Kogyo to Expand Cu Bonding Wire Output to 5 Times

Tanaka Denshi Kogyo of Tanaka Kikinzoku Group announced on 8 July the firm expands the output capacity of copper bonding wire to 5 times to 20 million meters per month. The firm will construct additional productive lines in Singapore plant, where the firm has produced copper bonding wire, while newly establish a productive line in Saga plant, Japan. The firm expects copper bonding wire demand could increase as substantial for gold bonding wire when gold price stays high.Tanaka Denshi Kogyo starts the sale of a new copper bonding wire “TCA1″ on 10 July. TCA1 is copper wire with 99.99% purity and 20-70 micrometers diameter, whose price is about a third compared with gold bonding wire.The firm forecasts global copper bonding wire market would double toward 2010 from 2008. The total bonding wire market, including gold, copper and aluminium wires, is expected to expand by 8% to 1.44 million meters in 2008 from 2007. The demand will increase along the growth of integrated circuit market.Tanaka Denshi Kogyo is the world largest supplier of bonding wires. The firm holds the top shares for gold and aluminium bonding wires while the second share for copper bonding wire.