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Nonferrous Metal News19/01/2005

Mitsui Mining And Smelting increases a research and development of thick electrolytic copper foil
Mitsui Mining And Smelting Company announced on 18th it would strengthen research and development of thick electrolytic copper foil in the United States. The firm will use a stopping equipment of multipurpose foil investing around $900,000, and test a plant and carry out mass production trial at Oak-Mitsui Technologies LLC, OMT, which is a research and development base. The firm plans to improve the stopping equipment for multipurpose foil in Ageo factory and start to operate in fiscal 2005, and increase a production system for a high value-added special foil.



Today's Japan Metal Bulletin E-mail
Mitsui Mining And Smelting increases a research and development of thick electrolytic copper foil
Meisei CO., LTD Establishs the Processing Plant in Malaysia
Kansai's Major Aluminium Alloy Makers Level off Material Purchase Prices

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